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| Unity Opto Technology Co., Ltd. Technical Data ALLEDs MSL-204TXWC 08/06/2003 Features l l Package : white topview PLCC-4 package with yellow clear epoxy. Feature of the device : extremely wide viewing angle ideal for backlighting and coupling in light guides l color : x/y coordinate : 0.31/0.32 o l Viewing angle : Lambertian Emitter (110 ) l Technology : InGaN on Sapphire (white) l Grouping parameter : luminous intensity , Chromaticity l Assembly methods : suitable for all SMT assembly methods l Soldering methods : IR reflow soldering l Preconditioning : acc. to JEDEC Level 2 l Taping : 8-mm tape with 2000/reel, 180mm Applications l Automotive : Dashboards , stop lamps , turn signals l Backlighting : LCDs , Key pads , advertising l Status indicators : Comsumer & industrial electronics 1 Package Dimensions Unit : mm (inches) Polarity 2 3 1 Cathode 4 Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is 0.1 unless other specified Recommended Solder Patterns Method of Taping / Polarity and Orientation Packing unit 2000/reel Cathode 4 1 3 2 Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is 0.1 unless other specified 2 Selection Guide Color of Part Number MSL-204TXWC Emission White Color of the Light Emitting Area Yellowish epoxy Luminous Intensity IV (mcd) @ 20mA 800 Optical Viewing Part Number (Degrees) Typ. MSL-204TXWC 120 Thermal RJ-S (oC/W) Thermal RJ-A (oC/W) Efficiency @IF=20mA (lm / W) Resistance Resistance Typ. 13 Typ. 220 Typ. 600 Forward Part Number Voltage VF (Volts) @IF = 20mA Min. MSL-204TXWC Typ. 3.5 Reverse Current IR (uA) @ VR = 5V Typ. 10 Chromaticity Coordinates (Typ.) x Typ. 0.31 y Typ. 0.32 Max 4.0 *The value are base on 1-die performance Maximum Ratings Parameter Operating Temp. range Storage Temp. range Symbol Value -30 ~ +85 -40 ~ +100 110 30 5 100 Unit o o o T OP T stg Tj IF VR P tot C C Junction temperature Forward current Reverse Voltage Power dissipation C mA V mW *The value are base on 1-die performance * The maximum driven current must lower than 30mA at the same time 3 Relative spektrale Emission Irel = f (), TA = 25oC, IF = 20mA V() = Standard eye response curve 1 White Relative Luminous Intensity 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 350 450 550 650 Wavelength (nm) FIG.1 RELATIVE LUMINOUS INTERSITY VS. WAVELENGTH 750 Forward Current IF = f (VF) TA = 25 C (mA) IF 50 40 30 20 10 0 1.2 o Relative Luminous Intensity IV/IV (20mA) = f (IF) TA = 25oC (V) IV 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 1.6 2.0 2.4 2.8 3.2 3.6 4.0 VF (V) 0 10 20 30 IF 40 (mA) Forward Voltage (V) FIG.2 FORWARD CURRENT VS. FORWARD VOLTAGE Forward Current IF(mA) FIG.3 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT Ambient Temperature VS. Allowable Forward (mA) IF 40 Radiation Characteristic Irel = f () 0o 10o 20o 30o Y X 30 40o 20 1.0 0.9 10 TA temp. ambient 0 0 20 40 60 80 T 100 (oC) 0.7 0.5 0.3 0.1 0.2 0.4 0.6 0.8 50o 60o 70o 80o 90o X Y Ambient Temperature TA (oC) FIG.4 FORWARD CURRENT VS. AMBIENT TEMPERATURE FIG.5 RADIATION DIAGRAM 4 IR Reflow Soldering Profile Temperature-Profile Tem p 2.5~5oC / sec. 2.5~5 C / sec. o Pre-heating o 120~150 C 240oC Max. 120sec. Max. 40sec. Max. Above 200oC Time 5 Unity White ALLED Bin Codes Category Code AA NF Luminous Intensity Group @ IF = 20mA (mcd) Max. Bin Code Min. U 450 710 710 1120 V AA 1120 1800 BA 1800 2800 CA 2800 3550 *1.The value are base on 3-dies performance *2.Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of 11% Color coordinates @ IF=20mA 2 3 4 Bin Code X Y X Y X Y X Y NA 0.264 0.317 0.283 0.353 0.283 0.305 0.264 0.267 NB 0.264 0.267 0.283 0.305 0.296 0.276 0.280 0.248 NC 0.283 0.353 0.330 0.400 0.330 0.380 0.283 0.325 ND 0.285 0.325 0.330 0.380 0.330 0.360 0.283 0.305 NE 0.283 0.305 0.330 0.360 0.330 0.339 0.287 0.295 NF 0.287 0.295 0.330 0.339 0.330 0.318 0.296 0.276 NG 0.296 0.276 0.330 0.318 0.33 0.298 0.296 0.256 NH 0.330 0.400 0.361 0.415 0.361 0.385 0.330 0.360 NI 0.330 0.360 0.361 0.385 0.361 0.351 0.330 0.318 *1.The value are base on 3-dies performance *2.Chromaticity coordinate groups are tested at a current pulse duration of 25 ms and a tolerance of 0.01 1 6 Surface Mount Moisture Sensitivity Specifications 1. Controlling Moisture Unity Opto Technology, in its design of packing materials and packing methods, takes into consideration the susceptibility of some Unity packages to moisture induced damage. The risk of this damage is caused when the LED lens plastic encapsulation material is exposed to increases or decreases in the Relative Humidity of the surrounding environment. Such damage may include delamination between the die and the LED lens plastic encapsulation material, which may result in open connections due to broken wire bonds. Moisture in the package having reached a critical level will fracture the package in order to escape when exposed to peak temperature conditions, typical in soldering practices. Therefore, the control of moisture levels in the LED package is critical to reduce the risk of moisture-induced failures. Please follow JEDEC-STD-033A standards for handling moisture sensitive devices. 2. Packaging SMD devices: Unity packages all SMD devices into dry pack bags (moisture barrier bags). Unity includes a desiccant pouch in each bag. Testing confirms that the desiccant pouch greatly reduces the presence of moisture by maintaining the environment in the bag, thus protecting the devices during shipment and storage. 3. Handling Dry Packed Parts Upon receipt, the bags should be inspected for damage to ensure that the bag's integrity has been maintained. Inspection should verify that there are no holes, gouges, tears, or punctures of any kind that may expose the contents of the bag. To open the bag, simply cut across the top of the bag as close to the original seal as possible being careful not to damage the contents. Once open the desired quantity of units should be removed and the bag resealed. If the bag is left open longer than 2 hours, the desiccant pouch should be replaced with a dry desiccant and the bag should be sealed immediately to avoid moisture damage. 7 |
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